Sealing Business
Features
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Excellent heat resistance
By introducing a special FFKM polymer with the highest heat resistance, we offer a heat-resistant grade that can be used in high-temperature processes.
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Specialized for low particle and low outgassing
Damage from plasma is reduced by mixing special filler in particle emission, which is the cause of decreased yield in semiconductor and FPD manufacturing processes. The series also includes grades that minimize emission gas leakage from sealing parts, which is another cause of decreased yield.
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Extensive lineup
With our long-standing manufacturing know-how and original formulating technology, we offer an extensive lineup that provides you with optimum materials suitable for a variety of applications. You may also increase cost performance with the support of products from our existing lineup.
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Specialized for a variety of resistance properties (solvents, chemicals, low metal elution, low adhesion, etc.)
In addition to grades with superior resistance to solvents and low metal elution, we can also provide a wide range of materials with resistance to various chemicals.
Lineup
You can choose materials according to your process requirements.
Pororoca 875B
- Extensive chemical resistance (including amine, steam, and ozone)
- Long-lasting sealing performance and excellent mechanical properties
Pororoca 251B
- Balanced heat resistance / chemical resistance performance (Standard heat resistance: 320°C)
Pororoca 252W
- Heat resistant, non-carbon material (Standard heat resistance: 300°C)
Pororoca G80C
- Contains no metallic filler, providing excellent purity
Pororoca IOTA
- General purpose fluororubber optimized for low outgassing performance
Seal Selection Guide for Semiconductor Use
Process | Use / Device | Recommended Material | Material Characteristics |
---|---|---|---|
A)Lithography | |||
Resist coating / development |
|
875B |
|
B)Etching / Ashing | |||
Wet process |
|
875B |
|
Dry process |
|
251B
252W |
|
C)Cleaning / Resist Separation | |||
Resist stripping |
|
875B |
|
Cleaning | G80C |
|
|
D)Oxidation / Diffusion | |||
|
251B |
|
|
E)Electrode / Wiring | |||
|
251B |
|
|
F)Insulating Film Formation | |||
|
IOTA |
|
|
G)Polishing | |||
Chemical/physical polishing |
|
875B |
|
Series Physical Properties List
Property name\Normal physical property | Color | Heat resistance ℃ |
Hardness Shore A |
Tensile strength MPa |
100% Tensile stress MPa |
Elongation % |
Compression set JIS test specimen 200°C 70 h % |
Compression set O-ring 200℃70H % |
Compression set O-ring 250℃70H % |
Compression set O-ring 300℃70H % |
Outgas quantity 200℃ μg/g |
---|---|---|---|---|---|---|---|---|---|---|---|
Test conditions | - | - | JIS K6253 |
JIS K6251 | JIS K6262 Compression ratio: 25% |
O-ring:P25 Compression ratio: 25% |
- | ||||
Pororoca 875B |
Black | 220 | 75 | 16.5 | 6.3 | 180 | 12 | 18 | - | - | - |
Pororoca 251B |
Black | 320 | 75 | 21 | 8.7 | 210 | 16 | 18 | - | 39 | - |
Pororoca 252W |
White | 300 | 75 | 18 | 7.1 | 260 | - | 33 | - | 63 | - |
Pororoca G80C |
Amber | 220 | 80 | 19.3 | 3.5 | 430 | - | 54 | - | - | - |
Pororoca IOTA |
Black | 220 | 75 | 15.8 | 4.7 | 246 | 10 | - | - | - | 9.0 |
Series Resistance List
- [Usage]
- +++:Recommended
- ++:Applicable
- +:Applicable depending on location
- NR:Not recommended
Material name\Item | Base polymer | Recommended use D:dry W:wet |
Heavy metal elution | Heat-generated gas | Chemical resistance | Plasma resistance | |||||
---|---|---|---|---|---|---|---|---|---|---|---|
Organic acids | Inorganic acids | Amine | Solvents | High concentration ozone | Oxygen | Halogen | |||||
Pororoca 875B |
FFKM | D/W | ++ | ++ | +++ | +++ | +++ | +++ | +++ | ++ | ++ |
Pororoca 251B |
FFKM | D/W | + | ++ | +++ | +++ | +++ | +++ | +++ | ++ | ++ |
Pororoca 252W |
FFKM | D | - | ++ | - | - | - | - | - | ++ | +++ |
Pororoca G80C |
FKM | D | +++ | + | - | - | - | - | - | + | + |
Pororoca IOTA |
FKM | D | - | +++ | - | - | - | - | - | + | + |